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US Patent 11704463 Method of etch model calibration using optical scatterometry

Patent 11704463 was granted and assigned to Lam Research on July, 2023 by the United States Patent and Trademark Office.

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Patent
Patent
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Patent attributes

Patent Applicant
Lam Research
Lam Research
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Current Assignee
Lam Research
Lam Research
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
117044630
Date of Patent
July 18, 2023
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Patent Application Number
173013450
Date Filed
March 31, 2021
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Patent Citations
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US Patent 7739651 Method and apparatus to determine if a pattern is robustly manufacturable
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US Patent 7812966 Method of determining the depth profile of a surface structure and system for determining the depth profile of a surface structure
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US Patent 7849423 Method of verifying photomask data based on models of etch and lithography processes
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US Patent 7921383 Photolithographic process simulation including efficient result computation for multiple process variation values
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US Patent 7962867 Electronic design for integrated circuits based on process related variations
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US Patent 7967995 Multi-layer/multi-input/multi-output (MLMIMO) models and method for using
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US Patent 8001512 Method and system for implementing context simulation
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US Patent 8102408 Computer-implemented methods and systems for determining different process windows for a wafer printing process for different reticle designs
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Patent Citations Received
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US Patent 11921433 Optical metrology in machine learning to characterize features
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Patent Primary Examiner
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Bryce M Aisaka
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Computer-implemented methods of optimizing a process simulation model that predicts a result of a semiconductor device fabrication operation to process parameter values characterizing the semiconductor device fabrication operation are disclosed. The methods involve generating cost values using a computationally predicted result of the semiconductor device fabrication operation and a metrology result produced, at least in part, by performing the semiconductor device fabrication operation in a reaction chamber operating under a set of fixed process parameter values. The determination of the parameters of the process simulation model may employ pre-process profiles, via optimization of the resultant post-process profiles of the parameters against profile metrology results. Cost values for, e.g., optical scatterometry, scanning electron microscopy and transmission electron microscopy may be used to guide optimization.

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