Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 25, 2023
0Patent Application Number
172867380
Date Filed
October 18, 2019
0Patent Citations
...
Patent Primary Examiner
Provided is a technique suitable for multilayering thin semiconductor elements via adhesive bonding while avoiding wafer damage in a method of manufacturing a semiconductor device, the method in which semiconductor elements are multilayered through laminating wafers in which the semiconductor elements are fabricated. The method of the present invention includes bonding and removing. In the bonding step, a back surface
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