Patent attributes
A semiconductor device manufacturing method of stacking semiconductor chips in layers over a semiconductor substrate having, close to its main surface, semiconductor chips, connecting semiconductor chips in different layers to enable signal transmission, and singularizing the layered semiconductor chips into pieces. The method includes steps of forming an insulating layer on the main surface of the semiconductor substrate; stacking the semiconductor chips over the semiconductor chips of the semiconductor substrate in such a manner as to interpose the insulating layer between them and an opposite surface of each disposed semiconductor chip opposes the insulating layer, the opposite surface being opposite to the main surface; forming, in each of the disposed semiconductor chips, a via hole penetrating from the main to the opposite surface; and forming a connection which enables signal transmission between the disposed semiconductor chips and the corresponding semiconductor chips of the semiconductor substrate via the via holes.
