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US Patent 11676956 Semiconductor device manufacturing method

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Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Date of Patent

June 13, 2023

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Patent Application Number

172867380

Date Filed

October 18, 2019

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Patent Citations

US Patent 8415202 Method of manufacturing semiconductor device

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US Patent 8415235 Adhesive, adhesive sheet, and process for producing electronic components

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US Patent 9391049 Molding package assembly and molding material

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US Patent 9406748 Perfectly shaped controlled nanowires

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US Patent 10947425 Adhesive

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US Patent 10014292 3D semiconductor device and structure

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US Patent 10964576 Electrostatic attachment chuck, method for manufacturing the same, and semiconductor device manufacturing method

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US Patent 7494845 Method of forming a thin wafer stack for a wafer level package

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Patent Primary Examiner

Julio J Maldonado

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CPC Code

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Provided is a technique suitable for multilayering thin semiconductor elements via adhesive bonding while avoiding wafer damage in a method of manufacturing a semiconductor device, the method in which semiconductor elements are multilayered through laminating wafers in which the semiconductor elements are fabricated. The method of the present invention includes bonding and removing. In the bonding step, a back surface

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