US Patent 11715733 Integrated circuit device and method
Patent 11715733 was granted and assigned to Taiwan Semiconductor Manufacturing Company on August, 2023 by the United States Patent and Trademark Office.
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US Patent 11715733 Integrated circuit device and method
Article
An integrated circuit (IC) device includes a substrate, and a cell over the substrate. The cell includes at least one active region and at least one gate region extending across the at least one active region. The cell further includes at least one input/output (IO) pattern configured to electrically couple one or more of the at least one active region and the at least one gate region to external circuitry outside the cell. The at least one IO pattern extends obliquely to both the at least one active region and the at least one gate region.
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Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
117157330
Date of Patent
August 1, 2023
0Patent Application Number
173134740
Date Filed
May 6, 2021
0Patent Citations
Patent Primary Examiner
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