US Patent 11756789 Semiconductor manufacturing method and apparatus thereof
Patent 11756789 was granted and assigned to Taiwan Semiconductor Manufacturing Company on September, 2023 by the United States Patent and Trademark Office.
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US Patent 11756789 Semiconductor manufacturing method and apparatus thereof
Article
The present disclosure provides an apparatus for manufacturing a semiconductor structure. The apparatus includes a stage, an optical transceiver over the stage, configured to obtain a first profile of a first surface of a substrate, an acoustic transceiver over the stage, configured to obtain a second profile of a top surface of a photo-sensitive layer over the substrate, wherein the stage is adapted to be displaced based on the first profile and the second profile.
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
11756789
Patent Inventor Names
Wen-Chih Wang
Yung-Yao Lee
Date of Patent
September 12, 2023
Patent Application Number
17561010
Date Filed
December 23, 2021
Patent Citations
Patent Primary Examiner
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