Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Bi-Ming Yen
Pei Yen Hsia
Ping-Jung Huang
Hung-Lung Hu
Jieh-Chau Huang
Ying Ting Hsia
Date of Patent
September 19, 2023
Patent Application Number
17350036
Date Filed
June 17, 2021
Patent Citations
Patent Primary Examiner
Patent abstract
The present disclosure relates to an apparatus for wafer cleaning. The apparatus includes an enclosure made of a noncombustible material, a wafer holder, a cleaning nozzle, at least one sensor, and an exhaust unit. The wafer holder can hold and heat a wafer. The cleaning nozzle can supply a flow of a cleaning fluid onto a surface of the wafer. The at least one sensor can detect attributes of the wafer. The exhaust unit can expel a vapor generated by the cleaning fluid in the enclosure. The exhaust unit can include a rinse nozzle to rinse the vapor passing through the exhaust unit with a mist.
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