US Patent 11768989 Reduced area standard cell abutment configurations
Patent 11768989 was granted and assigned to Taiwan Semiconductor Manufacturing Company on September, 2023 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
December 21, 2021
Date of Patent
September 26, 2023
Patent Applicant
Patent Application Number
17558157
Patent Citations
Patent Inventor Names
Chi-Yu Lu
Pin-Dai Sue
Hui-Zhong Zhuang
Li-Chun Tien
Yi-Hsin Ko
Patent Jurisdiction
Patent Number
Patent Primary Examiner
CPC Code
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