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US Patent 11775460 Communicating data with stacked memory dies

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
Date Filed
July 13, 2022
Date of Patent
October 3, 2023
Patent Applicant
Micron Technology
Micron Technology
Patent Application Number
17864023
Patent Citations
‌
US Patent 8054689 Memory card using multi-level signaling and memory system having the same
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US Patent 8275027 Multi-mode transmitter
‌
US Patent 8363707 Mixed-mode signaling
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US Patent 7124221 Low latency multi-level communication interface
‌
US Patent 7269212 Low-latency equalization in multi-level, multi-line communication systems
‌
US Patent 7308058 Transparent multi-mode PAM interface
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US Patent 7394715 Memory system comprising memories with different capacities and storing and reading method thereof
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US Patent 8451147 Data interface circuit
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US Patent 8509321 Simultaneous bi-directional link
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US Patent 8582373 Buffer die in stacks of memory dies and methods
•••
Patent Inventor Names
Dean D. Gans
Timothy M. Hollis
Jeffrey P. Wright
Robert Nasry Hasbun
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11775460
Patent Primary Examiner
‌
Chun Kuan Lee
CPC Code
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G06F 13/42
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G11C 5/06
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G11C 5/02
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G11C 11/225
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G11C 5/063
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G06F 13/1689
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G11C 7/1069
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G11C 11/4093
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G11C 11/4096
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G11C 5/04
•••

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