US Patent 11777036 Integrated assemblies and methods of forming integrated assemblies
Patent 11777036 was granted and assigned to Micron Technology on October, 2023 by the United States Patent and Trademark Office.
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US Patent 11777036 Integrated assemblies and methods of forming integrated assemblies
Some embodiments include an integrated assembly having an upwardly-extending structure with a sidewall surface. Two-dimensional-material extends along the sidewall surface. First electrostatic-doping-material is adjacent a lower region of the two-dimensional-material, insulative material is adjacent a central region of the two-dimensional-material, and second electrostatic-doping-material is adjacent an upper region of the two-dimensional-material. A conductive-gate-structure is over the first electrostatic-doping-material and adjacent to the insulative material. Some embodiments include methods of forming integrated assemblies.
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