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US Patent 11791311 Electronic device

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
March 29, 2021
Date of Patent
October 17, 2023
Patent Application Number
17216621
Patent Citations
‌
US Patent 8207605 Semiconductor device having a sealing resin and method of manufacturing the same
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US Patent 8541874 Semiconductor device
‌
US Patent 8890305 Semiconductor device
‌
US Patent 8901748 Direct external interconnect for embedded interconnect bridge package
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US Patent 9324699 Semiconductor device
‌
US Patent 9396998 Semiconductor device having fan-in and fan-out redistribution layers
‌
US Patent 9780074 Semiconductor package using a coreless signal distribution structure
‌
US Patent 10475747 Integrated fan-out package and method for fabricating the same
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US Patent 10991673 Electronic device
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US Patent 7795721 Semiconductor device and method for manufacturing the same
•••
Patent Inventor Names
Yoichiro Kurita
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11791311
Patent Primary Examiner
‌
Tong-Ho Kim
CPC Code
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H01L 2224/16227
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H01L 2224/17181
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H01L 2224/81005
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H01L 23/49811
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H01L 23/5383
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H01L 23/5389
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H01L 23/49816
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H01L 2224/32225
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H01L 2224/73204
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H01L 2924/15311
•••

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