US Patent 11803009 Photonics structures having a locally-thickened dielectric layer
Patent 11803009 was granted and assigned to GlobalFoundries on October, 2023 by the United States Patent and Trademark Office.
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US Patent 11803009 Photonics structures having a locally-thickened dielectric layer
Article
Patent abstract
Photonics structures including an optical component and methods of fabricating a photonics structure including an optical component. The photonics structure includes an optical component, a substrate having a cavity and a dielectric material in the cavity, and a dielectric layer positioned in a vertical direction between the optical component and the cavity. The optical component is positioned in a lateral direction to overlap with the cavity in the substrate.
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Judson Holt
Shesh Mani Pandey
Steven M. Shank
Yusheng Bian
Date of Patent
October 31, 2023
Patent Application Number
17680421
Date Filed
February 25, 2022
Patent Citations
Patent Primary Examiner
CPC Code
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