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US Patent 11804439 Reducing RC delay in semiconductor devices
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Patent
Date Filed
May 16, 2022
Date of Patent
October 31, 2023
Patent Application Number
17745509
Patent Citations
US Patent 8232618 Semiconductor structure having a contact-level air gap within the interlayer dielectrics above a semiconductor device and a method of forming the semiconductor structure using a self-assembly approach
US Patent 9406804 FinFETs with contact-all-around
US Patent 9443769 Wrap-around contact
US Patent 9520482 Method of cutting metal gate
US Patent 9548366 Self aligned contact scheme
US Patent 9576814 Method of spacer patterning to form a target integrated circuit pattern
US Patent 9831183 Contact structure and method of forming
US Patent 9859386 Self aligned contact scheme
US Patent 10157778 Semiconductor structure and manufacturing method thereof
US Patent 10211146 Air gap over transistor gate and related method
•••
Patent Inventor Names
Gulbagh Singh
Po-Jen Wang
Kun-Tsang Chuang
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11804439
Patent Primary Examiner
Patricia D Valenzuela
CPC Code
H01L 27/1203
H01L 23/535
H01L 21/743
H01L 21/76802
H01L 21/7682
H01L 23/5226
H01L 23/5329
H01L 23/4821
H01L 23/5223
H01L 23/485
•••
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