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US Patent 11837476 Flip-chip package with reduced underfill area

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
May 15, 2020
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Date of Patent
December 5, 2023
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Patent Application Number
16874751
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Patent Citations
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US Patent 9368480 Semiconductor device and method of manufacturing semiconductor device
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US Patent 9768145 Methods of forming multi-die package structures including redistribution layers
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US Patent 10796976 Semiconductor device and method of forming the same
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US Patent 10249515 Electronic device package
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US Patent 11121051 Semiconductor packages and method of manufacturing the same
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US Patent 7359211 Local control of underfill flow on high density packages, packages and systems made therewith, and methods of making same
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US Patent 8982577 Electronic component package having bleed channel structure and method
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Patent Inventor Names
Yazhou Zhang
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Paul Qu
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Hope Chiu
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Jiandi Du
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11837476
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Patent Primary Examiner
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Dale E Page
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CPC Code
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H01L 23/31
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H01L 21/563
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