Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Moonseob Jeong0
Yunhyeok Im0
Heeseok Lee0
Youngsang Cho0
Date of Patent
December 5, 2023
0Patent Application Number
179834870
Date Filed
November 9, 2022
0Patent Citations
Patent Primary Examiner
Patent abstract
A semiconductor package includes a package substrate, a lower semiconductor chip on the package substrate, an interposer on the lower semiconductor chip, the interposer including a plurality of pieces spaced apart from each other, an upper semiconductor chip on the interposer, and a molding member covering the lower semiconductor chip and the interposer.
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