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US Patent 8704364 Reducing stress in multi-die integrated circuit structures

Patent 8704364 was granted and assigned to Xilinx on April, 2014 by the United States Patent and Trademark Office.

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Patent abstract

An integrated circuit structure can include a first interposer and a second interposer. The first interposer and the second interposer can be coplanar. The integrated circuit structure further can include at least a first die that is coupled to the first interposer and the second interposer.

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