US Patent 8704364 Reducing stress in multi-die integrated circuit structures
Patent 8704364 was granted and assigned to Xilinx on April, 2014 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
February 8, 2012
0
Date of Patent
April 22, 2014
0
Patent Application Number
13369215
0
Patent Inventor Names
Bahareh Banijamali
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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