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US Patent 11852590 Systems and methods for metrology with layer-specific illumination spectra

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Is a
Patent
Patent
0

Patent attributes

Patent Applicant
KLA-Tencor
KLA-Tencor
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
118525900
Patent Inventor Names
Amnon Manassen0
Daria Negri0
Yuri Paskover0
Andrew V. Hill0
Ohad Bachar0
Vladimir Levinski0
Date of Patent
December 26, 2023
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Patent Application Number
165521070
Date Filed
August 27, 2019
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Patent Citations
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US Patent 9702693 Apparatus for measuring overlay errors
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US Patent 9709905 System and method for dark field inspection
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US Patent 9903711 Feed forward of metrology data in a metrology system
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US Patent 9921487 Method for inspecting photoresist pattern
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US Patent 9958784 Super-resolution imaging photolithography
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US Patent 10197389 Approaches in first order scatterometry overlay based on introduction of auxiliary electromagnetic fields
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US Patent 10371626 System and method for generating multi-channel tunable illumination from a broadband source
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US Patent 10422508 System and method for spectral tuning of broadband light sources
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Patent Primary Examiner
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Violeta A Prieto
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CPC Code
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G01N 21/8422
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G01N 21/3563
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G01N 21/33
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G01N 21/8806
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G01B 2210/56
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G01B 11/272
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G01N 2021/8438
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G01N 21/9505
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Patent abstract

A metrology system may include an imaging sub-system including one or more lenses and a detector to image a sample, where the sample includes metrology target elements on two or more sample layers. The metrology system may further include a controller to determine layer-specific imaging configurations of the imaging sub-system to image the metrology target elements on the two or more sample layers within a selected image quality tolerance, where each layer-specific imaging configuration includes a selected configuration of one or more components of the imaging sub-system. The controller may further receive, from the imaging sub-system, one or more images of the metrology target elements on the two or more sample layers generated using the layer-specific imaging configurations. The controller may further provide a metrology measurement based on the one or more images of the metrology target elements on the two or more sample layers.

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