Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hai-Ching Chen0
Tien-I Bao0
Bo-Jiun Lin0
Hsin-Chieh Yao0
Date of Patent
July 18, 2017
0Patent Application Number
148505320
Date Filed
September 10, 2015
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A method for fabricating a semiconductor structure includes providing a substrate and a first layer over the substrate, wherein the first layer includes one or more overlay marks. The method further includes forming one or more layers on the first layer and performing a dark field (DF) inspection on the one or more overlay marks underlying the one or more layers to receive a post-film-formation data.
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