US Patent 11916013 Via interconnects including super vias
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US Patent 11916013 Via interconnects including super vias
Article
Patent abstract
Interconnect structures including super vias are formed during back-end-of-line processing using sacrificial placeholders to protect the bottom portions of the super vias while upper portions of the super vias are formed. The sacrificial placeholders are removed and replaced by metal conductors that fill the bottom and upper portions of the super vias.
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Patent Number
Patent Inventor Names
Chanro Park0
Christopher J. Waskiewicz0
Eric Miller0
Yann Mignot0
Date of Patent
February 27, 2024
0Patent Application Number
174658150
Date Filed
September 2, 2021
0Patent Citations
Patent Primary Examiner
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