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US Patent 11916013 Via interconnects including super vias

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
September 2, 2021
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Date of Patent
February 27, 2024
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Patent Application Number
17465815
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Patent Citations
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US Patent 9385078 Self aligned via in integrated circuit
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US Patent 9805972 Skip via structures
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US Patent 10020254 Integration of super via structure in BEOL
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US Patent 10896874 Interconnects separated by a dielectric region formed using removable sacrificial plugs
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US Patent 10354912 Forming self-aligned vertical interconnect accesses (VIAs) in interconnect structures for integrated circuits (ICs)
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US Patent 10978388 Skip via for metal interconnects
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US Patent 7256502 Metal interconnections for semiconductor devices including a buffer layer on a trench sidewall
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US Patent 9059257 Self-aligned vias formed using sacrificial metal caps
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Patent Inventor Names
Christopher J. Waskiewicz
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Eric Miller
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Chanro Park
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Yann Mignot
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11916013
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Patent Primary Examiner
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Thanhha S. Pham
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CPC Code
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H01L 21/76831
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H01L 21/76832
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H01L 21/76834
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H01L 23/485
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H01L 23/522
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H01L 23/5226
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H01L 23/481
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H01L 21/76829
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