Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Po-Hsiang Huang0
Fong-Yuan Chang0
Chin-Chou Liu0
Noor E. V. Mohamed0
Date of Patent
March 5, 2024
0Patent Application Number
173803050
Date Filed
July 20, 2021
0Patent Citations
Patent Primary Examiner
Patent abstract
A three dimensional Integrated Circuit (IC) Power Grid (PG) may be provided. The three dimensional IC PG may comprise a first IC die, a second IC die, an interface, and a power distribution structure. The interface may be disposed between the first IC die and the second IC die. The power distribution structure may be connected to the interface. The power distribution structure may comprise at least one Through-Silicon Vias (TSV) and a ladder structure connected to at least one TSV.
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