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US Patent 8552563 Three-dimensional semiconductor architecture

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Is a

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Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Date of Patent

October 8, 2013

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Patent Application Number

126529000

Date Filed

January 6, 2010

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Patent Citations Received

US Patent 12113005 Packages with Si-substrate-free interposer and method forming same

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US Patent 11756887 Backside floating metal for increased capacitance

US Patent 11769718 Packages with Si-substrate-free interposer and method forming same

US Patent 11923271 3D IC power grid

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Patent Primary Examiner

Allan R. Wilson

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