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US Patent 8552563 Three-dimensional semiconductor architecture
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Edits on 9 Oct, 2024
"update inverses"
Golden AI
edited on 9 Oct, 2024
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Patent Citations Received
US Patent 12113005 Packages with Si-substrate-free interposer and method forming same
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Edits on 12 Mar, 2024
"update inverses"
Golden AI
edited on 12 Mar, 2024
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Patent Citations Received
US Patent 11923271 3D IC power grid
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Edits on 27 Sep, 2023
"update inverses"
Golden AI
edited on 27 Sep, 2023
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+1
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Infobox
Patent Citations Received
US Patent 11769718 Packages with Si-substrate-free interposer and method forming same
Edits on 13 Sep, 2023
"update inverses"
Golden AI
edited on 13 Sep, 2023
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Patent Citations Received
US Patent 11756887 Backside floating metal for increased capacitance
Edits on 21 May, 2023
"Remove leading 0 from patent number"
Golden AI
edited on 21 May, 2023
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US Patent 08552563 Three-dimensional semiconductor architecture
US Patent 8552563 Three-dimensional semiconductor architecture
Infobox
Patent Number
08552563
0
Patent Number
8552563
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Edits on 23 Sep, 2022
"Entity importer update"
Golden AI
edited on 23 Sep, 2022
Infobox
Is a
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
08552563
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Date of Patent
October 8, 2013
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Patent Application Number
12652900
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Date Filed
January 6, 2010
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Patent Primary Examiner
Allan R. Wilson
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Edits on 18 Dec, 2021
"Created via: Entity Importer"
Golden AI
created this topic on 18 Dec, 2021
Edits made to:
Infobox
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+7
properties)
US Patent 08552563 Three-dimensional semiconductor architecture
Infobox
Is a
Patent
Patent jurisdiction
United States Patent and Trademark Office
Patent number
08552563
Date of patent
October 8, 2013
Patent application number
12652900
Date Filed
January 6, 2010
Patent primary examiner
Allan R. Wilson
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