US Patent 11923271 3D IC power grid
Patent 11923271 was granted and assigned to Taiwan Semiconductor Manufacturing Company on March, 2024 by the United States Patent and Trademark Office.
All edits
Edits on 12 Mar, 2024
Golden AI
Edits made to:
Infobox (+20 properties)
Article (+501 characters)
US Patent 11923271 3D IC power grid
Article
Patent abstract
A three dimensional Integrated Circuit (IC) Power Grid (PG) may be provided. The three dimensional IC PG may comprise a first IC die, a second IC die, an interface, and a power distribution structure. The interface may be disposed between the first IC die and the second IC die. The power distribution structure may be connected to the interface. The power distribution structure may comprise at least one Through-Silicon Vias (TSV) and a ladder structure connected to at least one TSV.
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chin-Chou Liu0
Fong-Yuan Chang0
Noor E. V. Mohamed0
Po-Hsiang Huang0
Date of Patent
March 5, 2024
0Patent Application Number
173803050
Date Filed
July 20, 2021
0Patent Citations
Patent Primary Examiner
Find more entities like US Patent 11923271 3D IC power grid
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
