US Patent 11923350 Light emitting diode package structure
Patent 11923350 was granted and assigned to Unimicron Technology on March, 2024 by the United States Patent and Trademark Office.
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US Patent 11923350 Light emitting diode package structure
A manufacturing method of a light emitting diode (LED) package structure includes the following steps. A carrier is provided. A redistribution layer is formed on the carrier. A plurality of active devices are formed on the carrier. A plurality of LEDs are transferred on the redistribution layer. The LEDs and the active devices are respectively electrically connected to the redistribution layer. The active devices are adapted to drive the LEDs, respectively. A molding compound is formed on the redistribution layer to encapsulate the LEDs. The carrier is removed to expose a bottom surface of the redistribution layer.
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