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US Patent 11955333 Methods and apparatus for processing a substrate

Patent 11955333 was granted and assigned to Applied Materials on April, 2024 by the United States Patent and Trademark Office.

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Patent abstract

Methods and apparatus for processing a substrate are provided herein. For example, a method includes supplying a vaporized precursor into a processing volume, supplying activated elements including ions and radicals from a remote plasma source, energizing the activated elements using RF source power at a first duty cycle to react with the vaporized precursor to deposit an SiNH

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