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US Patent 11959606 Package structure with supporting frame

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Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Ming-Sung Tsai0

Cheng-Ying Lee0

Chen-Hsiu Lin0

Date of Patent

April 16, 2024

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Patent Application Number

172168270

Date Filed

March 30, 2021

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Patent Citations

US Patent 10516081 High efficiency hexagon LED for micro LED application

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US Patent 9324687 Wafer-level passive device integration

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US Patent 7834375 Submounts for semiconductor light emitting devices and methods of forming packaged light emitting devices including dispensed encapsulants

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Patent Primary Examiner

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CPC Code

0

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Patent abstract

A package structure including a carrier, a photonic device, a supporting frame, and an encapsulant is provided. The photonic device is disposed on the carrier. The supporting frame is disposed on the carrier and surrounds the photonic device. The encapsulant covers the supporting frame and surrounds the photonic device.

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