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US Patent 11959606 Package structure with supporting frame

Overview Structured Data Issues Contributors Activity

Is a

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Date Filed

March 30, 2021

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Date of Patent

April 16, 2024

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Patent Application Number

17216827

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Patent Citations

US Patent 10516081 High efficiency hexagon LED for micro LED application

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US Patent 9324687 Wafer-level passive device integration

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US Patent 7834375 Submounts for semiconductor light emitting devices and methods of forming packaged light emitting devices including dispensed encapsulants

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Patent Inventor Names

Ming-Sung Tsai

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Cheng-Ying Lee

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Chen-Hsiu Lin

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Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

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Patent Primary Examiner

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CPC Code

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