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US Patent 11978661 Ultralow-K dielectric-gap wrapped contacts and method

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
December 11, 2020
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Date of Patent
May 7, 2024
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Patent Application Number
17118697
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Patent Citations
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US Patent 9202774 Semiconductor device with air gap and method for fabricating the same
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US Patent 9412659 Semiconductor structure having source/drain gouging immunity
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US Patent 9484250 Air gap contact formation for reducing parasitic capacitance
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US Patent 10164029 Semiconductor structure and manufacturing method thereof
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US Patent 10319680 Metal contact via structure surrounded by an air gap and method of making thereof
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US Patent 10490444 Semiconductor devices having an air gap
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US Patent 11328982 Air gap seal for interconnect air gap and method of fabricating thereof
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US Patent 10923565 Self-aligned contact air gap formation
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US Patent 11551968 Inter-wire cavity for low capacitance
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US Patent 8241991 Method for forming interconnect structure having airgap
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•••
Patent Inventor Names
Felix P. Anderson
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Fuad H. Al-Amoody
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Siva P. Adusumilli
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Mark D. Levy
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Spencer H. Porter
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11978661
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Patent Primary Examiner
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Daniel Luke
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CPC Code
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H01L 21/76843
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H01L 21/7682
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H01L 29/41725
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H01L 21/76829
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H01L 21/76865
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