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US Patent 11978724 Diffused bitline replacement in memory

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
0
Date Filed
December 22, 2022
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Date of Patent
May 7, 2024
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Patent Application Number
18145375
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Patent Citations
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US Patent 11056348 Bonding surfaces for microelectronics
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US Patent 11355443 Dielets on flexible and stretchable packaging for microelectronics
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US Patent 11367652 Microelectronic assembly from processed substrate
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US Patent 11373963 Protective elements for bonded structures
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US Patent 11380597 Bonded structures
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US Patent 11385278 Security circuitry for bonded structures
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US Patent 11387202 Nanowire bonding interconnect for fine-pitch microelectronics
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US Patent 11387214 Multi-chip modules formed using wafer-level processing of a reconstituted wafer
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US Patent 11393779 Large metal pads over TSV
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US Patent 11462419 Microelectronic assemblies
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•••
Patent Inventor Names
Stephen Morein
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11978724
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Patent Primary Examiner
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Phuc T. Dang
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CPC Code
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H01L 21/76877
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H01L 21/823481
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H01L 25/50
0
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H01L 25/0657
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H01L 21/02532
0
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H01L 21/3212
0
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H01L 21/76802
0

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