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US Patent 11991888 3D stackable memory and methods of manufacture
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Patent
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Date Filed
June 29, 2023
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Date of Patent
May 21, 2024
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Patent Application Number
18343912
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Patent Citations
US Patent 8586960 Integrated circuit including vertical diode
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US Patent 8912517 Resistive switching memory
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US Patent 10157962 Resistive random access memory
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US Patent 9577009 RRAM cell with PMOS access transistor
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US Patent 10593375 Semiconductor memory device with correcting resistances in series with memory array signal lines
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US Patent 6937505 Nonvolatile memory cell and nonvolatile semiconductor memory device
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US Patent 7978499 Semiconductor storage device
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Patent Inventor Names
Yu-Ming Lin
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Han-Jong Chia
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Sai-Hooi Yeong
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Meng-Han Lin
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Chih-Yu Chang
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11991888
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Patent Primary Examiner
Cheung Lee
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CPC Code
H01L 29/42392
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H01L 29/66969
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H01L 29/7869
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H01L 29/78696
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H01L 29/861
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H01L 29/24
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H01L 29/0673
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H01L 27/0688
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H01L 21/823475
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H01L 21/8221
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