Create
Log in
Sign up
Golden has been acquired by ComplyAdvantage.
Read about it here ⟶
US Patent 11996409 Stacking CMOS structure
Overview
Structured Data
Issues
Contributors
Activity
Access by API
Access by API
Is a
Patent
0
Date Filed
December 9, 2020
0
Date of Patent
May 28, 2024
0
Patent Application Number
17116552
0
Patent Citations
US Patent 8803316 TSV structures and methods for forming the same
0
US Patent 8816444 System and methods for converting planar design to FinFET design
0
US Patent 8823065 Contact structure of semiconductor device
0
US Patent 8860148 Structure and method for FinFET integrated with capacitor
0
US Patent 8993380 Structure and method for 3D IC package
0
US Patent 9105490 Contact structure of semiconductor device
0
US Patent 9236267 Cut-mask patterning process for fin-like field effect transistor (FinFET) device
0
US Patent 9236300 Contact plugs in SRAM cells and the method of forming the same
0
US Patent 9281254 Methods of forming integrated circuit package
0
US Patent 9299649 3D packages and methods for forming the same
0
•••
Patent Inventor Names
Ching-Wei Tsai
0
Chia-En Huang
0
Yu-Xuan Huang
0
Kuan-Lun Cheng
0
Patent Jurisdiction
United States Patent and Trademark Office
0
Patent Number
11996409
0
Patent Primary Examiner
David C Spalla
0
CPC Code
H01L 29/7851
0
H01L 21/02603
0
H01L 21/8221
0
H01L 21/823431
0
H01L 21/823821
0
H01L 21/823871
0
H01L 21/823878
0
H01L 21/845
0
H01L 23/481
0
H01L 23/5226
0
•••
Find more entities like US Patent 11996409 Stacking CMOS structure
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Company
Home
Press & Media
Blog
Careers
WE'RE HIRING
Products
Knowledge Graph
Query Tool
Data Requests
Knowledge Storage
API
Pricing
Enterprise
ChatGPT Plugin
Legal
Terms of Service
Enterprise Terms of Service
Privacy Policy
Help
Help center
API Documentation
Contact Us
SUBSCRIBE