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US Patent 12009312 Semiconductor device package
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Patent
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Date Filed
September 23, 2021
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Date of Patent
June 11, 2024
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Patent Application Number
17483720
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Patent Citations
US Patent 11291108 Radio-frequency module with shield wall
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US Patent 11183465 Radio-frequency module
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US Patent 11488934 Semiconductor package and manufacturing method thereof
0
US Patent 10163867 Semiconductor package and manufacturing method thereof
0
US Patent 10863656 Radio-frequency module
0
Patent Inventor Names
Chanyuan Liu
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Kuo-Hsien Liao
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Yu-Hsiang Sun
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
12009312
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Patent Primary Examiner
Long Pham
0
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