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US Patent 12011715 Tailorable electrode capping for microfluidic devices

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
November 11, 2020
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Date of Patent
June 18, 2024
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Patent Application Number
17095538
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Patent Citations
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US Patent 7960269 Method for forming a double embossing structure
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US Patent 8314494 Metal cap layer of increased electrode potential for copper-based metal regions in semiconductor devices
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US Patent 8941240 Fabricating a contact rhodium structure by electroplating and electroplating composition
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US Patent 9023137 Electroless deposition of platinum on copper
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US Patent 9147635 Contact-based encapsulation
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US Patent RE46671 Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device
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US Patent 10247700 Embedded noble metal electrodes in microfluidics
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US Patent 10168299 Reproducible and manufacturable nanogaps for embedded transverse electrode pairs in nanochannels
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US Patent 10560065 Piezoelectric resonator manufacturing method and piezoelectric resonator
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US Patent 7190079 Selective capping of copper wiring
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•••
Patent Inventor Names
Adele L. Pacquette
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Joshua T. Smith
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Benjamin Hardy Wunsch
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Eugene J. O'Sullivan
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
12011715
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Patent Primary Examiner
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Jill A Warden
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CPC Code
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B01L 2200/12
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B01L 2300/0645
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B01L 3/502715
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B01L 3/502707
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G01N 15/12
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