Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Po-Chen Lai0
Li-Ling Liao0
Shin-Puu Jeng0
Po-Yao Lin0
Ming-Chih Yew0
Chin-Hua Wang0
Date of Patent
June 18, 2024
0Patent Application Number
174608360
Date Filed
August 30, 2021
0Patent Citations
Patent Primary Examiner
CPC Code
Patent abstract
A package structure is provided. The package structure includes a redistribution structure over a substrate, a semiconductor die over the redistribution structure and electrically coupled to the substrate, and an underfill material over the substrate and encapsulating the redistribution structure and the semiconductor die. The underfill material includes an extension portion overlapping a corner of the semiconductor die and extending into the substrate.
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