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US Patent 12080640 Self-aligned via to metal line for interconnect

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
September 15, 2021
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Date of Patent
September 3, 2024
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Patent Application Number
17475995
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Patent Citations
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US Patent 9679805 Self-aligned back end of line cut
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US Patent 9793164 Self-aligned metal cut and via for back-end-of-line (BEOL) processes for semiconductor integrated circuit (IC) fabrication, and related processes and devices
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US Patent 9812351 Interconnection cells having variable width metal lines and fully-self aligned continuity cuts
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US Patent 9953834 Method of making self-aligned continuity cuts in mandrel and non-mandrel metal lines
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US Patent 10002222 System and method for perforating redundant metal in self-aligned multiple patterning
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US Patent 10049920 Reduced tip-to-tip and via pitch at line end
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US Patent 10396026 Precut metal lines
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US Patent 10079173 Methods of forming metallization lines on integrated circuit products and the resulting products
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US Patent 11244861 Method and structure for forming fully-aligned via
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US Patent 9299583 Aluminum oxide selective etch
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•••
Patent Inventor Names
Alexander Reznicek
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Tao Li
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Ruilong Xie
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Tsung-Sheng Kang
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
12080640
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Patent Primary Examiner
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Allison Bernstein
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CPC Code
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H01L 23/5283
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H01L 21/76897
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H01L 23/53257
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H01L 21/76885
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H01L 23/5226
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H01L 21/76892
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H01L 23/5329
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