A method for processing cardboard includes the steps of irradiating a surface of a cardboard blank with a first laser in order to remove material from the cardboard blank according to a first pattern. The first laser is irradiated with a first laser power and with a laser beam thereof being scanned with a first scanning speed. The first laser power is greater than or equal to 0.5 kW. The first scanning speed is greater than or equal to 2000 mm/s and less than or equal to 25000 mm/s. The method also includes the step of irradiating the surface of the cardboard blank with the first laser in order to remove material from the cardboard blank according to the first pattern and is carried out while the cardboard blank is being conveyed.