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US Patent 12113054 Non-volatile dynamic random access memory

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
October 14, 2020
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Date of Patent
October 8, 2024
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Patent Application Number
17070253
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Patent Citations
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US Patent 11011494 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics
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US Patent 11387202 Nanowire bonding interconnect for fine-pitch microelectronics
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US Patent 11387214 Multi-chip modules formed using wafer-level processing of a reconstituted wafer
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US Patent 11393779 Large metal pads over TSV
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US Patent 11462419 Microelectronic assemblies
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US Patent 11476213 Bonded structures without intervening adhesive
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US Patent 11515291 Integrated voltage regulator and passive components
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US Patent 6887769 Dielectric recess for wafer-to-wafer and die-to-die metal bonding and method of fabricating the same
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US Patent 6908027 Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process
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US Patent 6952368 Semiconductor device with non-volatile memory and random access memory
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•••
Patent Inventor Names
Pearl Po-Yee Cheng
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David Edward Fisch
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Javier A. Delacruz
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
12113054
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Patent Primary Examiner
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Hung K Vu
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