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US Patent 12125806 Electronic device packages with internal moisture barriers
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Patent
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Date Filed
July 7, 2023
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Date of Patent
October 22, 2024
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Patent Application Number
18219422
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Patent Citations
US Patent 7906799 Nitride-based transistors with a protective layer and a low-damage recess
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US Patent 8338933 Three-dimensional package structure
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US Patent 8223500 Memory card and method for manufacturing the same
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US Patent 9293407 Semiconductor package having a baseplate with a die attach region and a peripheral region
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US Patent 6921929 Light-emitting diode (LED) with amorphous fluoropolymer encapsulant and lens
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US Patent 7263294 Infrared data communication module and method of making the same
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Patent Inventor Names
Basim Noori
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Arthur Pun
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
12125806
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Patent Primary Examiner
Peniel M Gumedzoe
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CPC Code
H01L 23/296
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H01L 23/3114
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H01L 23/49513
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H01L 23/4952
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H01L 23/49562
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H01L 23/49575
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H01L 23/66
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H01L 2223/6683
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H01L 23/293
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H01L 23/047
0
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