US Patent 12135296 Edge inspection of silicon wafers by image stacking

Embodiments described herein provide for a defect detection system and method suitable for detecting defects on an edge of a wafer. The method includes placing at least two wafers sequentially on a conveyor. Images of at least the edges of each wafer placed on the conveyor are captured and sent to a controller. A defect detection software combines the images to show the edges of the wafers in a virtual stack. The virtual stack allows for a pattern of defects to be identified. The pattern of defects in close proximity will allow for identification of the defects in the edges of the wafers.