US Patent 12136759 Antenna-in-package devices and methods of making
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US Patent 12136759 Antenna-in-package devices and methods of making
Article
Patent abstract
A semiconductor device has a PCB with an antenna and a semiconductor package mounted onto the PCB. An epoxy molding compound bump is formed or disposed over the PCB opposite the semiconductor package. A first shielding layer is formed over the PCB. A second shielding layer is formed over the semiconductor package. A board-to-board (B2B) connector is disposed on the PCB or as part of the semiconductor package. A conductive bump is disposed between the semiconductor package and PCB.
Infobox
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Patent Jurisdiction
Patent Number
Patent Inventor Names
HunTeak Lee0
KyoungHee Park0
KyungHwan Kim0
SangJun Park0
SeungHyun Lee0
Date of Patent
November 5, 2024
0Patent Application Number
174528550
Date Filed
October 29, 2021
0Patent Citations
Patent Primary Examiner
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