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US Patent 12136759 Antenna-in-package devices and methods of making

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
October 29, 2021
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Date of Patent
November 5, 2024
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Patent Application Number
17452855
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Patent Citations
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US Patent 10566298 Package on antenna package
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US Patent 10672727 Semiconductor package providing protection from electrical noise
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US Patent 11510311 Electronic component module and method for manufacturing electronic component module
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US Patent 10685924 Antenna-on-package arrangements
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US Patent 11756894 Radio-frequency (RF) integrated circuit (IC) (RFIC) packages employing a substrate sidewall partial shield for electro-magnetic interference (EMI) shielding, and related fabrication methods
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US Patent 9859232 Semiconductor package device and method of manufacturing the same
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US Patent 10163773 Electronics package having a self-aligning interconnect assembly and method of making same
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Patent Inventor Names
SangJun Park
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KyungHwan Kim
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KyoungHee Park
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SeungHyun Lee
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HunTeak Lee
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
12136759
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Patent Primary Examiner
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Tuan T Dinh
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CPC Code
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H01L 23/66
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H01L 23/3107
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H01Q 1/38
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H01Q 1/2283
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H01Q 1/22
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H01L 23/556
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H01L 23/552
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H05K 1/18
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H05K 1/141
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H05K 1/14
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