Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
David White0
Taber H. Smith0
Vikas Mehrotra0
Date of Patent
December 19, 2006
Patent Application Number
10164847
Date Filed
June 7, 2002
Patent Citations Received
Patent Primary Examiner
Patent abstract
A method and system are described to reduce process variation as a result of the electrochemical deposition (ECD), also referred to as electrochemical plating (ECP), and chemical mechanical polishing (CMP) processing of films in integrated circuit manufacturing processes. The described methods use process variation and electrical impact to direct the insertion of dummy fill into an integrated circuit.
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