Patent 7183152 was granted and assigned to Advanced Micro Devices on February, 2007 by the United States Patent and Trademark Office.
A method of forming a fin for a fin field effect transistor (FinFET) includes defining a trench in a layer of first material, where a width of an opening of the trench is substantially smaller than a thickness of the layer. The method includes growing a second material in the trench to form the fin and removing the layer of first material.