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US Patent 7192807 Wafer level package and fabrication method

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
May 5, 2005
Date of Patent
March 20, 2007
Patent Application Number
11123605
Patent Citations Received
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US Patent 12087679 Package core assembly and fabrication methods
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US Patent 11881447 Package core assembly and fabrication methods
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US Patent 11887934 Package structure and fabrication methods
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US Patent 11927885 Fluoropolymer stamp fabrication method
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US Patent 11931855 Planarization methods for packaging substrates
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US Patent 11942581 Semiconductor device with transmissive layer and manufacturing method thereof
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US Patent 11676832 Laser ablation system for package fabrication
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US Patent 11705365 Methods of micro-via formation for advanced packaging
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US Patent 11715700 Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration
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US Patent 11837680 Substrate structuring methods
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•••
Patent Inventor Names
Ronald Patrick Huemoeller
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Sukianto Rusli
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David Razu
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
7192807
Patent Primary Examiner
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Lex H Malsawma

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