US Patent 7329321 Enhanced wafer cleaning method
Patent 7329321 was granted and assigned to Lam Research on February, 2008 by the United States Patent and Trademark Office.
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Patent Inventor Names
John M. Boyd0
John deLarios0
Mark Wilcoxson0
Seokmin Yun0
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Patent abstract
A method for removing post-processing residues in a single wafer cleaning system is provided. The method initiates with providing a first heated fluid to a proximity head disposed over a substrate. Then, a meniscus of the first fluid is generated between a surface of the substrate and an opposing surface of the proximity head. The substrate is linearly moved under the proximity head. A single wafer cleaning system is also provided.
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US Patent 07329321 Enhanced wafer cleaning method US Patent 7329321 Enhanced wafer cleaning method
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Patent Number
073293210
Patent Number
73293210
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Current Assignee
Patent Jurisdiction
Patent Number
073293210
Date of Patent
February 12, 2008
0Patent Application Number
110619440
Date Filed
February 17, 2005
0Official Website
Patent Primary Examiner
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US Patent 07329321 Enhanced wafer cleaning method
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07329321
Date of patent
February 12, 2008
Patent application number
11061944
Date Filed
February 17, 2005
Patent primary examiner
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