Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
June 30, 2009
Patent Application Number
11598084
Date Filed
November 13, 2006
Patent Citations Received
Patent Primary Examiner
Patent abstract
An object of the present invention is to prevent formation of a badly situated via metal in a Damascene wiring portion in multiple layers having an air-gap structure. In the present invention, a via is completely separated from an air-gap 45 by forming an interlayer insulating film 44 having the air-gap 45 between adjacent Damascene wiring portions after forming a sacrifice film pillar 42 from a selectively removable insulating film in a formation region of a connection hole. The present invention can provide multiple-layered buried wiring in which a high reliable via connection and a reduced parasitic capacitance due to the air-gap are achieved.
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