Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
November 10, 2009
Patent Application Number
11584486
Date Filed
October 23, 2006
Patent Primary Examiner
Patent abstract
A method of manufacturing a micro-element package which can reduce a manufacturing cost and improve productivity by simplifying its structure and manufacturing process, and also can make contributions to miniaturization and thinness, and the micro-element package are provided. The method of the micro-element package including: providing a substrate having a micro-element on its top surface and a transparent cover having a groove on its bottom surface; attaching the transparent cover on the substrate, wherein the bottom surface of the transparent cover where the groove is formed faces the micro-element; exposing the groove by selectively eliminating the transparent cover; and dicing the substrate along the exposed groove.
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