US Patent 7615397 Micro-element package and manufacturing method thereof
Patent 7615397 was granted and assigned to Samsung on November, 2009 by the United States Patent and Trademark Office.
Name
# Contributions
Last Contribution
Find more entities like US Patent 7615397 Micro-element package and manufacturing method thereof
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
